Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds
By A Mystery Man Writer
Description
The tunable negative thermal expansion covering a wide temperature range around room temperature in Sn, Mn co-substituted Mn 3 ZnN - Dalton Transactions (RSC Publishing) DOI:10.1039/D0DT02221G
Advances in Epoxy Molding Compounds - Dexter Technical Paper (1992)
WO1999032553A1 - Epoxy mold compound and method - Google Patents
Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound - ScienceDirect
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